Design, Manufacture and Assembly, etc. of High Speed PCB.

Date: March 17, 2017
Tender No: CDACP/NIC/2016/204

C-DAC invites tenders for 'Design, Signal Integrity Validation, Manufacture and Assembly of High Speed Printed Circuit Board (PCB)' at C-DAC, Pune. Prospective Bidders may download the Tender Document from / and submit the bids on-line as per the Tender Document, along with a document fee of Rs. 2000/- (non refundable) by Demand Draft favouring C-DAC, Pune payable at Pune.


Tender Information
Date of Release of Tender: March 17, 2017
Pre-Bid Meeting Date: March 29, 2017
Last Date for Submission: April 20, 2017 (1530 Hrs)


  Click to Download the Tender Documents
(File Type: PDF, File Size: 1.39 MB, Date: 17/03/2017)

  Response to the queries
(File Type: PDF, File Size: 544 KB, Date: 31/03/2017)


(A Scientific Society of the Ministry of Communications and IT, Govt. of India)
Pune University Campus, Pune - 411 007
Tel: +91 - 20 - 25704100
Fax: +91 - 20 - 25694004