Expression of Interest (EoI) from qualified and experienced vendors for offering services such as Packaging, Multi-Project Wafer (MPW) Prototyping & Post Silicon Validation for DLI on boarded companies
Tender No: C-DACB/EOI- PKG-MPW-PSV/2024-25
Enabling Packaging, Multi-Project Wafer (MPW) Prototyping and Post Silicon Validation Services For ChipIN Centre
| Tender Information | |
|---|---|
| Date of Release of Tender: | 2024-10-18 13:00:00 |
| Last Date for Submission: | 2024-11-04 14:00:00 |
Click here to download Tender Document
(File Type: PDF, File Size: 925.222 KB, Date: 18/10/2024)
Click here to download Invitation for Expressions of Interest (EoI)
Note:
(File Type: PDF, File Size: 1874.802 KB, Date: 18/10/2024)
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CENTRE FOR DEVELOPMENT OF ADVANCED COMPUTING (C-DAC)
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